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SIM-ST-MFF2
Part number：
SIM-ST-MFF2
CLASSIFICATION：
RF and Wireless
manufacturer：
Hologram, Inc.
describe：
GLOBAL IOT EMBEDDED SIM CHIP
package：
Tape & Reel (TR)
ROHS status：
Yes
currency：
USD
PDF:
RFQ Add to RFQ list
inventory 1600
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specifications
  • Part Status
    Discontinued at
  • Features
    -
  • Size / Dimension
    5mm L x 6mm W x 0.82mm H
  • Operating Temperature
    -
  • Core Processor
    -
  • Class
    -
  • Memory
    -
  • Format
    ESIM (MFF2)
  • Carrier Network
    -
  • Network Technology
    2G, 3G, 4G LTE IOT
  • 18098902467

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